Trend bei Kfz-ICs: ASSPs statt ASICs. Autosar und Flex-Ray werden schon 2006 implementiert
Transient thermal impedance considerations in power semiconductor applications
TPMS and RKE operating in the same ISM frequency band
Total-dose hardness assurance for low Earth orbit
Toshiba announces world's first image recognition LSI for intelligent vehicle systems
Though digital IC's gain rapidly, today's automotive electronics remains mostly linear, discrete
Thomson-CSF develops new lightweight, electronically scanned radar for Rafale
The use of VHSIC/VLSIC gate array in improving military digital electronic hardware
The status of automotive electronics in Europe
The role of CAE/CAD in the avionics integrity program (AVIP)
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package
Thermal analysis of a high density TMOS used in an automotive solide-state relay
The prediction of the radiation-stimulated failure rate for integrated circuits
The potential and the problems involved in integrated anti-lock braking systems
The past, present and future of EEE components for space application; COTS-the next generation
The monolithic A/D converter - an under-hood data acquisition interface
The monolithic A/D converter - An under-hood data acquisition interface
The Influence of Knowledge Accumulation on Buyer-Supplier Codevelopment Projects
The impact of semi-custom IC's on automotive applications
The impact of microelectronics of railway signalling
The evolution of a test concept active components in the interface test adapter
The engineering design of an integrated UHF aircraft antenna
The development of 270 VDC solid state power controllers
The design of a modular avionic processor
The design and performance of an in-car misfire warning light system
The associative comparator: adds new capabilities to ESM signal processing
The application of fault testing to a railway signalling system
The ACE family of MIL-STD-1553 terminals gets smaller
Thales components and technologies for T/R modules
Test structure for measurement of conductive film thickness
Technology trends in unattended ground sensor systems
Technology teamwork-mos and bipolar
Technology innovation. 'The industry high wire walk'
Technologie-Trends geprägt durch die neuen Bordnetzkonzepte
Taking a rad-hard semicustom IC from prototype to production
System-oriented integrated circuit technologies and their application to automotive functions
Surge protection IC for the switch interface of ECUs
Supersmart: Logik und Leistung auf einem Chip. BCD-5-Technologie ermöglicht Systemintegration
Supercomputer applications to test systems (avionics and weapons applications)
SuperCap-Based Energy Back-up System for Automotive Electronic Control Units
Strategies for lot acceptance testing using CMOS transistors and ICs