Synonyme wurden verwendet für:
encapsulation
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keywords:(encapsulation)
3-layered 3D flex based MCM: electrical characterization and reliability issues
Accelerated testing of flip chip packages under dynamic load
An electrostatic accelerator for ultrahypervelocity microprojectiles
A Novel Technology for Thermal Control for ISP module for Space Applications
A study of chip top delamination in plastic encapsulated packages under temperature loading
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Geraeuschkapselung aus Kunststoff bei Kraftfahrzeugen am Beispiel des VW-LT
Heat transfer and thermal management of electric vehicle batteries with phase change materials
Lärmminderungsmaßnahmen in einem Großpreßwerk. Simulation erlaubt Vorhersagen
Long life radioisotopic power sources encapsulated in platinum metal alloys
Mechanical Properties of Steel Encapsulated Metal Matrix Composites
Model for BGA and CSP reliability in automotive underhood applications
Multilayer alumina substrates for ECU (automotive electronics)
Neue Werkstoffe und Entwicklungs-Tools für den Hitzeschutz
New techniques and thermoplastics for encapsulating automotive sensors and solenoids
Novel composites for space microelectronics and optics
Optimal sizing of powder handling horizontal capsule pipelines
Performance of new silicone adhesives and encapsulants at high and low temperatures
Plastic encapsulated components for cars
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Reliability potential of epoxy based encapsulants for automotive applications
Simulation of modular mechatronic systems with application to vehicle dynamics
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
Stability of spore-based biosensing systems under extreme conditions
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Test method for availability of holes in height - temperature barrier on cementation process