Spin apply polymer coatings can be used in packaging applications as a stress buffer passivation layer for improved device reliability. They can also serve as dielectric and passivation layers in bond pad redistribution circuits for flip-chip packaging. A high Tg photodefinable polyimide was selected for both applications, due to good chemical resistance and desirable adhesion characteristics to silicon nitride, various molding compounds, aluminum, and to itself. The product exhibited a wide process window, and tapered via slopes were obtained for metallization through minor process modifications.
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Solid State Technology ; 43 , 11 ; 125-126
2000
2 Seiten, 3 Quellen
Aufsatz (Zeitschrift)
Englisch
Adhäsion , Kraftfahrzeugelektronik , Glasbildung , integrierte Schaltung , Metallisieren , Halbleitergehäuse , Zuverlässigkeit , Eigenspannung , Formverfahren , Passivierung , Photolithographie , Kunststoffgehäuse , Polymerfilm , Oberflächenchemie , Gerätesicherheit , dielektrische Schicht , chemische Beständigkeit , Siliciumnitrid , Pressmasse , Aluminium , Kraftwagen , Prozessfenster , Glasübergang , Flip-Chip-Bauelement
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