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encapsulation
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keywords:(encapsulation)
Thermal management for high performance computing in spaceborne applications
Variable emissivity through MEMS technology
Acceleration threshold switches from an additive electroplating MEMS process
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Optimized cooling systems for high-power semiconductor devices
Plastic encapsulated components for cars
Novel composites for space microelectronics and optics
Accelerated testing of flip chip packages under dynamic load
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories
High temperature, high power density packaging for automotive applications
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
Model for BGA and CSP reliability in automotive underhood applications
Thermal management of military fighter aircraft electro-optics pod: an invited paper
An improved, linear homopolar, electromagnetic launcher: STAR
Thermal characterization of a mercury arc lamp for a projection display system
New method for electrothermal simulations: HDTMOS in automotive applications
The changing automotive environment: high-temperature electronics
Stackable In-Line Underwater Missile Launch System for a Modular Payload Bay
Reliability potential of epoxy based encapsulants for automotive applications
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
Metal-enclosed, air-insulated traction switchgear - developments and applications
Test method for availability of holes in height - temperature barrier on cementation process
High efficiency, high reliability 2 kW inverter for aeronautical application
A study of chip top delamination in plastic encapsulated packages under temperature loading
MEMS package in a harsh environment for aeronautic applications
Novel component packaging for high current applications using power semiconductor devices
Design limitations of powertrain electronics - automotive EMC challenges
A Novel Technology for Thermal Control for ISP module for Space Applications
Heat transfer and thermal management of electric vehicle batteries with phase change materials
High density packaging for automotive applications
Stability of spore-based biosensing systems under extreme conditions
Jet Blast Resistance Experiment of Engineered Material Arresting System