For space applications, can cost-effective and reliable heavy ion single-event effect (SEE) testing still be carried out on commercially available, plastic packaged, high-density memories? Their complexity, architecture, and packaging assemblies as well as their short life cycle pose many practical problems that needs to be tackled. This paper summarizes steps taken by the European Space Agency in order to address these issues.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories


    Beteiligte:
    Harboe-Sorensen, R. (Autor:in) / Guerre, F.X. (Autor:in) / Loquet, J.G. (Autor:in) / Tizon, C. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    2003


    Format / Umfang :

    6 Seiten, 9 Quellen




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch