The evolution of automotive electronics packaging is being accelerated by the increased use of electronics in cars, but is constrained by the severe under-hood environment, by product reliability needs, and by cost. The technologies necessary to be competitive continue to evolve. For example, five years ago hybrid chip and wire were regarded as reliable but too costly; now PCB (Printed Circuit Board) and plastic component technology is functional, but too bulky. Future low cost severe environment ECU (Electronic Control Unit) packaging solutions with good heat dissipation are expected with confidence.


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    Titel :

    Future low cost electronics packaging for automotive applications


    Weitere Titelangaben:

    Zukünftige preiswerte Halbleitergehäuse für die Kraftfahrzeugelektronik


    Beteiligte:
    Hellemanns, R. (Autor:in) / Lewandowski, P. (Autor:in) / Bonhomme, G. (Autor:in)


    Erscheinungsdatum :

    1993


    Format / Umfang :

    9 Seiten, 1 Bild, 4 Tabellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





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