This paper is an overview of environmetal issues involved in the manufacturing of electronic packages for automotive applications, including the development of lead-free solders for no-clean thick film and printed wiring board (PWB) modules. This paper discusses issues that need to be addressed in the development of lead-free solders for automotive electronics packaging applications. These issues include: solder alloy development and selection; flux compatibility for no-clean application; lead-free component terminations and substrate coatings, thermal impact on temperature sensitive components; metallurgical interactions; electromigration and dendritic growth; durability testing; etc.


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    Titel :

    Lead-free solder development for automotive electronics packaging applications


    Weitere Titelangaben:

    Entwicklung bleifreier Lote für Kraftfahrzeugelektronik-Bauelemente


    Beteiligte:
    Shangguan, Dongkai (Autor:in) / Achari, A. (Autor:in)


    Erscheinungsdatum :

    1995


    Format / Umfang :

    6 Seiten, 2 Bilder, 1 Tabelle, 8 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Lead Free Solder for Automotive Electronics

    Whitten, Gordon | SAE Technical Papers | 1998


    Lead free solder for automotive electronics

    Whitten,G. / Delphi Delco Electronics Systems,US | Kraftfahrwesen | 1998


    Lead Free Solder for Automotive Electronics

    Whitten, G. / Society of Automotive Engineers | British Library Conference Proceedings | 1998


    Implementation of lead-free solder for automotive electronics

    Baney,B.B. / Bezier,P. / Campbell,M.S. et al. | Kraftfahrwesen | 2000


    Implementation of Lead-Free Solder for Automotive Electronics

    Baney, Brenda B. / Walls, Delbert R. / Whitten, Gordon C. et al. | SAE Technical Papers | 2000