Several lead-free alloys have been studied for potential use in electronics by the National Center for Manufacturing Sciences(NCMS) Lead Free Solder Consortium that ended in 1996. Since then, one of these alloys has been studied using an existing product in order to determine the viability of Lead Free Vehicle Electronics. Design, supply chain, manufacturability, and reliability data for the electronics components and system are a part of this paper.


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    Titel :

    Lead Free Solder for Automotive Electronics


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    International Congress & Exposition ; 1998



    Erscheinungsdatum :

    1998-02-23




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Lead free solder for automotive electronics

    Whitten,G. / Delphi Delco Electronics Systems,US | Kraftfahrwesen | 1998


    Lead Free Solder for Automotive Electronics

    Whitten, G. / Society of Automotive Engineers | British Library Conference Proceedings | 1998


    Implementation of Lead-Free Solder for Automotive Electronics

    Baney, Brenda B. / Walls, Delbert R. / Whitten, Gordon C. et al. | SAE Technical Papers | 2000


    Implementation of lead-free solder for automotive electronics

    Baney,B.B. / Bezier,P. / Campbell,M.S. et al. | Kraftfahrwesen | 2000