Acceptance of the flat pack as a standard configuration for integrated circuits has stimulated development of new interconnection techniques which necessitated development of new criteria and controls for these techniques. One method being utilized at Martin-Denver is a hot gas soldering process in which the solder joints are made by passing the printed circuit board containing the flat packs under hot gas jets. Specification of this process for a possible space application necessitated development of inspection criteria and controls to ensure the required joint reliability. This was accomplished concurrently with development of the soldering process and qualification method.


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    Titel :

    Inspection and Control Requirements for Hot Gas Soldered Flat Pack Connections


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    Electronic Packaging Conference ; 1967



    Erscheinungsdatum :

    01.02.1967




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





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