Acceptance of the flat pack as a standard configuration for integrated circuits has stimulated development of new interconnection techniques which necessitated development of new criteria and controls for these techniques. One method being utilized at Martin-Denver is a hot gas soldering process in which the solder joints are made by passing the printed circuit board containing the flat packs under hot gas jets. Specification of this process for a possible space application necessitated development of inspection criteria and controls to ensure the required joint reliability. This was accomplished concurrently with development of the soldering process and qualification method.
Inspection and Control Requirements for Hot Gas Soldered Flat Pack Connections
Sae Technical Papers
Electronic Packaging Conference ; 1967
1967-02-01
Conference paper
English
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