Simple differential-pressure soldering method provides visual evidence that hidden joints are fully soldered. Intended for soldering connector pins in plated through holes in circuit boards. Molten solder flows into plated through holes, drawn by vacuum in manifold over circuit board. Differential-pressure process ensures solder wets entire through hole around connector pin.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    Ensuring Fully Soldered Through Holes


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    1987-05-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Vehicle design for soldered glazing connector

    LYON MICHAEL | Europäisches Patentamt | 2015

    Freier Zugriff

    Supports for Wires Soldered to Pins

    Hill, Arthur J. | NTRS | 1987


    VEHICLE GLAZING WITH A SOLDERED CONNECTOR

    LYON MICHAEL | Europäisches Patentamt | 2019

    Freier Zugriff

    THE SOLDERED ALUMINUM-FIN BRASS-TUBE RADIATOR

    GALE, WILLIAM S. | SAE Technical Papers | 1956


    Soldered flip chip IC's in automotive applications

    Thor, V. / Appel, K. / Nover, M. et al. | Tema Archiv | 1998