Stress concentrations reduced by reorienting wires. New solder-joint configuration provides support for part of wire most susceptible to damage from handling or vibration part next to solder joint. Reversal of wire and heat-shrinkable tubing reduce stress in this region.
Supports for Wires Soldered to Pins
NASA Tech Briefs ; 11 , 8
1987-09-01
Sonstige
Keine Angabe
Englisch
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