Micro-optoelectromechanical systems (MOEMS) having valuable performance, size, and cost attributes offer novel solutions to the design of lightwave network elements. We discuss the new challenges that realizing these benefits presents to the field of photonic packaging.


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    Titel :

    The challenges of packaging MEMS components for the all optical networks of the future


    Beteiligte:
    Ramsey, D.A. (Autor:in) / Basavanhally, N. (Autor:in) / Low, Y.L. (Autor:in) / Scotti, R.E. (Autor:in) / Bishop, D.J. (Autor:in)


    Erscheinungsdatum :

    2001-01-01


    Format / Umfang :

    206444 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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