Micro-optoelectromechanical systems (MOEMS) having valuable performance, size, and cost attributes offer novel solutions to the design of lightwave network elements. We discuss the new challenges that realizing these benefits presents to the field of photonic packaging.


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    Title :

    The challenges of packaging MEMS components for the all optical networks of the future


    Contributors:
    Ramsey, D.A. (author) / Basavanhally, N. (author) / Low, Y.L. (author) / Scotti, R.E. (author) / Bishop, D.J. (author)


    Publication date :

    2001-01-01


    Size :

    206444 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




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