Laser transmission bonding of silicon to silicon with metallic interlayers for wafer-level packaging
MICROSYSTEM TECHNOLOGIES ; 19 , 5 ; 669-673
01.01.2013
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Metallic wafer and chip bonding for LED packaging
IEEE | 2003
|Metallic wafer and chip bonding for led packaging
British Library Conference Proceedings | 2003
|Improved ZnS Windows for Silicon Solar Cells with Arsenic Interlayers
British Library Conference Proceedings | 1995
|Glass frit bonding: an universal technology for wafer level encapsulation and packaging
British Library Online Contents | 2005
|Silicon wafer transport device and silicon wafer transport vehicle
Europäisches Patentamt | 2024
|