Alternative resist adhesion and electroplating layers for LIGA process
MICROSYSTEM TECHNOLOGIES ; 6 ; 161-164
01.01.2000
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
A flip-chip LIGA assembly technique via electroplating
British Library Online Contents | 2001
|Linewidth design rules for microstructures manufactured in PMMA resist using X-ray LIGA
British Library Online Contents | 2010
|Photoresist application for the LIGA process
British Library Online Contents | 1998
|British Library Online Contents | 2007
|Nickel and copper electroplating of proton beam micromachined SU-8 resist
British Library Online Contents | 2002
|