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    Titel :

    Experimental Thermal Contact Conductance of Adhesives for Electronic Components


    Beteiligte:

    Kongress:

    Conference; 31st, 31st AIAA thermophysics conference ; 1996 ; New Orleans; LA



    Erscheinungsdatum :

    01.01.1996


    Format / Umfang :

    ALL


    Anmerkungen:

    Nos 96-1800 to 96-1911 with gaps; See also 6369.400F nos 96-1800 to 96-2277 for separate papers on microfiche and 6237.630 for 2 separate papers nos 51 and 57


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch


    Schlagwörter :


    Thermal contact conductance of adhesives for microelectronic systems

    Mirmira, S. / Marotta, E. / Fletcher, L. | AIAA | 1996


    Thermal Contact Conductance of Adhesives for Microelectronic Systems

    S. R. Mirmira / E. E. Marotta / L. S. Fletcher | AIAA | 1997


    Experimental Thermal Contact Conductance of Electronic Modules

    Lambert, M. A. / Cavenall, I. G. / Fletcher, L. S. et al. | British Library Conference Proceedings | 1996


    Experimental Thermal Contact Conductance of Electronic Modules

    M. A. Lambert / I. G. Cavenall / L. S. Fletcher | AIAA | 1997


    Experimental thermal contact conductance of electronic modules

    Lambert, M. / Cavenall, I. / Fletcher, L. | AIAA | 1996