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title: Photonics packaging and integration
Integration von Silicium-Photonik-IC für hohe Datenrate
Integration of silicon photonics IC for high data rate
Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The
...INTEGRATION OF SILICON PHOTONICS IC FOR HIGH DATA RATE
Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The
...Integration of silicon photonics ic for high data rate
Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The
...Integration of silicon photonics IC for high data rate
Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The
...INTEGRATION OF SILICON PHOTONICS IC FOR HIGH DATA RATE
Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The
...
Photonics for Space Flight Instruments
U.S.-Japan Joint Optoelectronics Project
Direction of Optoelectronics Research at ARPA
Novel alignment techniques for packaging and integration of optoelectronic components
Direction Of Optoelectronics Research At ARPA
Packaging Developments for Optoelectronic Components in Broadband Communication Networks
Optical Fiber Assemblies for Space Flight from the NASA Goddard Space Flight Center, Photonics Group
Photonic packaging for space applications
A Monolithic Integration Approach for VCSEL/GaAs FET Arrays
Photonic packaging for space applications
MT-compatible polymeric waveguide couplers for optoelectronic packaging [3952-26]