Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Packaging Developments for Optoelectronic Components in Broadband Communication Networks



    Conference:

    Summer topical meeting, Integrated optoelectronics ; 1994 ; Lake Tahoe; NV


    Published in:

    Publication date :

    1994-01-01


    Size :

    2 pages


    Remarks:

    Contains 4 conferences published jointly. IEEE Cat no 94TH0606-4; Shelving title: LEOS 1994



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Overview of MEMS technology for packaging optoelectronic components

    Wu, M. C. / Optical Society of America | British Library Conference Proceedings | 1998


    Optoelectronic Packaging

    Oman, H. | Online Contents | 1997


    Optoelectronic components make WDM networks practical

    Pan, J. J. / Liang, F. | British Library Online Contents | 1994


    Novel alignment techniques for packaging and integration of optoelectronic components

    Hausgjaa, P. O. | British Library Conference Proceedings | 1996


    Microrobotics in Optoelectronic Packaging

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1993