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encapsulation
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Mechanical Properties of Steel Encapsulated Metal Matrix Composites
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Stability of spore-based biosensing systems under extreme conditions
A Novel Technology for Thermal Control for ISP module for Space Applications
Reliability potential of epoxy based encapsulants for automotive applications
The changing automotive environment: high-temperature electronics
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
Model for BGA and CSP reliability in automotive underhood applications
Neue Werkstoffe und Entwicklungs-Tools für den Hitzeschutz
Novel composites for space microelectronics and optics
Accelerated testing of flip chip packages under dynamic load
Variable emissivity through MEMS technology
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Optimal sizing of powder handling horizontal capsule pipelines
Long life radioisotopic power sources encapsulated in platinum metal alloys
Teure aber unverzichtbare Helfer. Explosionsgeschützte Gabelstapler
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
New techniques and thermoplastics for encapsulating automotive sensors and solenoids
Performance of new silicone adhesives and encapsulants at high and low temperatures
An electrostatic accelerator for ultrahypervelocity microprojectiles
Lärmminderungsmaßnahmen in einem Großpreßwerk. Simulation erlaubt Vorhersagen
Werkstoffuntersuchungen an Faltenbaelgen fuer Gleichlaufgelenke
Wirtschaftliche Aspekte bei laermarmen Kraftfahrzeugen. Investitions- und Betriebskostenanalyse
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
Geraeuschkapselung aus Kunststoff bei Kraftfahrzeugen am Beispiel des VW-LT
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)