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Memory chip packaging-an enabling technology for high-performance recce systems
MECON - eine neuartige Hochspannungs-Steckverbindung für Unterwasser-Anwendungen
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Druckfest gekapselte Elektromotoren für den Offshore-Einsatz
Optimal sizing of powder handling horizontal capsule pipelines
Microwave multichip modules using low cost microwave chip on flex packaging technology
Reduction in size and weight of electronic modules through the evolution of packaging design
Motorola and MEMMS: the way up to a surface micromachined accelerometer
Long life radioisotopic power sources encapsulated in platinum metal alloys
Trockene MKK-Kondensatoren für moderne Schienenfahrzeuge