Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

61–80 of 147 hits
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    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archive | 1999
    Keywords: Verkapseln

    Memory chip packaging-an enabling technology for high-performance recce systems

    Kaufman, B. | Tema Archive | 1999
    Keywords: Chip-on-board-Kapselung

    MECON - eine neuartige Hochspannungs-Steckverbindung für Unterwasser-Anwendungen

    Ostergaard, I. / Sande, G. / Nysveen, A. et al. | Tema Archive | 1999
    Keywords: Kapselung

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)

    Multilayer alumina substrates for ECU (automotive electronics)

    Sugai, K. / Matsumoto, H. / Shimojyou, Y. et al. | Tema Archive | 1998
    Keywords: keramische Kapselung , Wärmehaushalt (Kapselung)

    Druckfest gekapselte Elektromotoren für den Offshore-Einsatz

    Sobel, W. / Osterthun, H. | Tema Archive | 1998
    Keywords: druckfeste Kapselung

    Vernetzte Polyolefin-Schaumstoffe im Automobilbereich

    Wolf, T. | Tema Archive | 1998
    Keywords: Kapselung

    An 8-Bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C Airborne Early Warning Aircraft radar

    Thompson, R.L. / Degerstrom, M.J. / Walters, W.L. et al. | Tema Archive | 1998
    Keywords: Wärmehaushalt (Kapselung)

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archive | 1998
    Keywords: Verkapseln

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archive | 1998
    Keywords: Verkapseln

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Verkapseln , Chip-on-board-Kapselung

    Microwave multichip modules using low cost microwave chip on flex packaging technology

    McNulty, M. / Schnell, J. / Nixon, D. | Tema Archive | 1998
    Keywords: Verkapseln

    Reduction in size and weight of electronic modules through the evolution of packaging design

    Bergamaschi, G. / Bettini, R. | Tema Archive | 1997
    Keywords: Kapselung

    Motorola and MEMMS: the way up to a surface micromachined accelerometer

    Delpoux, A. | Tema Archive | 1997
    Keywords: Verkapseln

    Long life radioisotopic power sources encapsulated in platinum metal alloys

    Franco-Ferreira, E.A. / Goodwin, G.M. / George, T.G. et al. | Tema Archive | 1997
    Keywords: Einkapselung

    Die Akustik des neuen V6-TDI-Motors im Audi A8

    Hofer, K. / Schedl, H. / Boom, J. van den | Tema Archive | 1997
    Keywords: Verkapseln

    Trockene MKK-Kondensatoren für moderne Schienenfahrzeuge

    Vetter, H. | Tema Archive | 1997
    Keywords: druckfeste Kapselung

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: keramische Kapselung