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Ganzheitliche simulationsbasierte Bewertung der Akustik von automobilen Antrieben
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions
Thesound reduction index applied to automotive problems
Jet Blast Resistance Experiment of Engineered Material Arresting System
Heat transfer and thermal management of electric vehicle batteries with phase change materials
High density packaging for automotive applications
Stability of spore-based biosensing systems under extreme conditions
A Novel Technology for Thermal Control for ISP module for Space Applications
MEMS package in a harsh environment for aeronautic applications
Akustisch optimierte Zusatzmaßnahmen auf einer blasgeformten Motorkapsel
Technologien zur funktionellen Integration von Akustik, Aerodynamik und Wärmemanagement
Test method for availability of holes in height - temperature barrier on cementation process
High efficiency, high reliability 2 kW inverter for aeronautical application
A study of chip top delamination in plastic encapsulated packages under temperature loading
Metal-enclosed, air-insulated traction switchgear - developments and applications
Ein neuer Außengeräuschprüfstand im Entwicklungsprozess bei BMW
Reliability potential of epoxy based encapsulants for automotive applications
Möglichkeiten zur Schallreduzierung bei Deckeln und Hauben
Thermal characterization of a mercury arc lamp for a projection display system
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
Neue Werkstoffe und Entwicklungs-Tools für den Hitzeschutz
Optimized cooling systems for high-power semiconductor devices
Novel composites for space microelectronics and optics
Accelerated testing of flip chip packages under dynamic load
Variable emissivity through MEMS technology
Acceleration threshold switches from an additive electroplating MEMS process
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
3-layered 3D flex based MCM: electrical characterization and reliability issues
Optimal sizing of powder handling horizontal capsule pipelines
Microwave multichip modules using low cost microwave chip on flex packaging technology