Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–20 of 49 hits
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    Powertrain co-simulation on top of standards

    Störmer, Christoph / Malz, Christoph / Mitrohin, Corina et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Jet Blast Resistance Experiment of Engineered Material Arresting System

    Xiao, Xian-Bo / Kong, Xiang-Jun / Shi, Ya-Jie et al. | Tema Archive | 2013
    Keywords: Einkapselung

    Comparison and Application of High Prestress and Intensive Support System in Close, Soft and Cracked Roadway Support

    Hu, Bin / Kang, Hong-Pu / Lin, Jian | Tema Archive | 2012
    Keywords: Einkapselung

    Material Performance Data Acquisition and Management System for Welded Pipe Used in the 2nd West-East Gas Pipeline

    Liu, Bai-Lin / Chen, Wen / Lei, Li et al. | Tema Archive | 2012
    Keywords: Einkapselung

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archive | 2011
    Keywords: Kapselung

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archive | 2010
    Keywords: Wärmehaushalt (Kapselung)

    Hydrogen for a global application to road transport

    Rinaldi, P. / Veca, G.M. | Tema Archive | 2007
    Keywords: Einkapselung

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archive | 2007
    Keywords: Verkapseln

    TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation

    Creusen, M. | Tema Archive | 2003
    Keywords: Einkapselung

    New development of a wet brake system

    Nowak, S. | Tema Archive | 2002
    Keywords: Verkapseln

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Thermal management for high performance computing in spaceborne applications

    Samson, J.R. jun. / Cutting, F.M. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archive | 1999
    Keywords: Verkapseln

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)