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encapsulation
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Mechanical Properties of Steel Encapsulated Metal Matrix Composites
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Neue Werkstoffe und Entwicklungs-Tools für den Hitzeschutz
Heat transfer and thermal management of electric vehicle batteries with phase change materials
Reliability potential of epoxy based encapsulants for automotive applications
Multilayer alumina substrates for ECU (automotive electronics)
Test method for availability of holes in height - temperature barrier on cementation process
Stability of spore-based biosensing systems under extreme conditions
Geraeuschkapselung aus Kunststoff bei Kraftfahrzeugen am Beispiel des VW-LT
A study of chip top delamination in plastic encapsulated packages under temperature loading
Werkstoffuntersuchungen an Faltenbaelgen fuer Gleichlaufgelenke
A Novel Technology for Thermal Control for ISP module for Space Applications
Variable emissivity through MEMS technology
Thesound reduction index applied to automotive problems
Long life radioisotopic power sources encapsulated in platinum metal alloys
Wirtschaftliche Aspekte bei laermarmen Kraftfahrzeugen. Investitions- und Betriebskostenanalyse
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
Performance of new silicone adhesives and encapsulants at high and low temperatures
Teure aber unverzichtbare Helfer. Explosionsgeschützte Gabelstapler
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
The changing automotive environment: high-temperature electronics
Novel composites for space microelectronics and optics
Simulation of modular mechatronic systems with application to vehicle dynamics
Lärmminderungsmaßnahmen in einem Großpreßwerk. Simulation erlaubt Vorhersagen
New techniques and thermoplastics for encapsulating automotive sensors and solenoids
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Optimal sizing of powder handling horizontal capsule pipelines
Model for BGA and CSP reliability in automotive underhood applications