High-temperature electronics for automotive applications are discussed. It is reported that, by extending existing technology, automotive electronics can be operated at temperatures between 150 degrees C and 200 degrees C. Automotive load dump and its effect on reliability and future automotive electronics development are also discussed. It is stated that the improved efficiency that can be achieved by operating at higher voltage can easily be offset by the increased component costs if the load dump transient is increased by two or four times its present value.


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    Title :

    Summary of additional topics from the session on packaging and reliability


    Additional title:

    Hochtemperaturelektronik für automative Anwendungen: Packungsdichte und Zuverlässigkeit


    Contributors:
    Johnson, R.W. (author) / Frank, R. (author)

    Published in:

    Publication date :

    1989


    Size :

    1 Seite


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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