High-temperature electronics for automotive applications are discussed. It is reported that, by extending existing technology, automotive electronics can be operated at temperatures between 150 degrees C and 200 degrees C. Automotive load dump and its effect on reliability and future automotive electronics development are also discussed. It is stated that the improved efficiency that can be achieved by operating at higher voltage can easily be offset by the increased component costs if the load dump transient is increased by two or four times its present value.


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    Titel :

    Summary of additional topics from the session on packaging and reliability


    Weitere Titelangaben:

    Hochtemperaturelektronik für automative Anwendungen: Packungsdichte und Zuverlässigkeit


    Beteiligte:
    Johnson, R.W. (Autor:in) / Frank, R. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1989


    Format / Umfang :

    1 Seite


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Additional Topics

    Saarlas, Maido | Wiley | 2006


    Summary and Future Research Topics

    Brokmann, Christopher | Springer Verlag | 2022


    Summary of Selected Vision Topics

    Winston, Patrick H. | DSpace@MIT | 1972

    Freier Zugriff

    Breakout Session Summary

    Trapp, Peter | Online Contents | 2005


    Summary of the Session

    Online Contents | 1996