Surface-mount and module-type discrete semiconductor packaging are discussed. Packaged product development, pilot production techniques, and a clean room environment are also discussed. A breed of module introduced by Motorola called ICePAK, which combines the high-volume production techniques normally associated with discrete components with customization capability, the key element of the hybrid power module design, is discussed in detail.


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    Title :

    Advances in discrete semiconductor packaging


    Additional title:

    Fortschritte bei der diskreten Halbleiterpackung


    Contributors:
    DuBois, J. (author)

    Published in:

    Publication date :

    1989


    Size :

    3 Seiten


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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