Surface-mount and module-type discrete semiconductor packaging are discussed. Packaged product development, pilot production techniques, and a clean room environment are also discussed. A breed of module introduced by Motorola called ICePAK, which combines the high-volume production techniques normally associated with discrete components with customization capability, the key element of the hybrid power module design, is discussed in detail.
Advances in discrete semiconductor packaging
Fortschritte bei der diskreten Halbleiterpackung
Automotive Power Electronics ; 76-78
1989
3 Seiten
Aufsatz (Konferenz)
Englisch
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