Surface-mount and module-type discrete semiconductor packaging are discussed. Packaged product development, pilot production techniques, and a clean room environment are also discussed. A breed of module introduced by Motorola called ICePAK, which combines the high-volume production techniques normally associated with discrete components with customization capability, the key element of the hybrid power module design, is discussed in detail.


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    Titel :

    Advances in discrete semiconductor packaging


    Weitere Titelangaben:

    Fortschritte bei der diskreten Halbleiterpackung


    Beteiligte:
    DuBois, J. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1989


    Format / Umfang :

    3 Seiten


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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