The increasing market for automotive passenger safety has created a need for low cost, reliable, and miniature accelerometers. This paper presents a surface mount accelerometer with integrated electronics which has been specially designed for high volume production. Cost optimization has led to a dual-chip package concept. The micromechanical chip is manufactured with a proprietary surface micromachining process on SIMOX (separation by implantation of oxygen) which enables to decrease the silicon area while maintaining an execellent level of performance. A CMOS ic used for signal conditioning. Prototypes with a full scale range of 50 g have been realized in ceramic leadless chip carriers. Performance tests demonstrate the compilance of linearity, frequency response, thermal drift, and resolution with the requirements of airbag application. The prototypes have been subjected to severe environmental tests with no failure or significant performance loss. A first approach of the manufacturing capability is also provided, based on statistical data.


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    Title :

    Surface mount accelerometer for high volume production


    Additional title:

    Mikrobeschleunigungsmesser bestehen aus einem Doppelchip für das kapazitive Meßsystem mit einer seismischen Masse und die Signalverarbeitung mit einer CMOS-Schaltung zur Auslösung eines Luftsackes in Personenwagen


    Contributors:

    Published in:

    Publication date :

    1996


    Size :

    4 Seiten, 7 Bilder, 4 Tabellen, 6 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English







    HIGH POWER SURFACE MOUNT PACKAGES

    Hundt, Michael | SAE Technical Papers | 1998


    High power surface mount packages

    Hundt,M. / ST Microelectronics,US | Automotive engineering | 1998