The use of fine pitch TAB interconnect in high performance ceramic packages designed to meet military standards poses unique problems not associated with general TAB applications. These problems include designing around the tolerances inherent to multilayer ceramic package manufacturing technologies, the ability to withstand the IC package assembly processes, and meeting stringent military requirements on the finished product. This paper discusses 4.1 mil (104 micrometer) pitch inner lead bond (ILB) and outer lead bond (OLB) TAB interconnect in a ceramic pin grid array custom designed for a 484 pad high performance ECL integrated circuit.


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    Title :

    TAB interconnect in high performance ceramic packages for military applications


    Additional title:

    TAB-Verbindungen in keramischen Hochleistungsgehäusen für militärische Anwendungen


    Contributors:
    Gould, N. (author) / Ewanich, J. (author) / Callahan, R. (author)


    Publication date :

    1992


    Size :

    10 Seiten, 3 Bilder, 4 Tabellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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