A comparison of several lead-free interconnection alternatives to the Pb95Sn5 solder alloy on different power electronics circuit carriers has been made. This comparison included various lead-free solder alloys and the promising, emerging low temperature joining (LTJ) technology. A general overview describing process experiences with the lead-free alternatives and the sample quality achieved will be provided. The reliability benchmark of the chosen combinations was conducted by passive thermal cycle testing between the temperature levels of -40 deg C and +150 deg C. The abort criteria was determined both by scanning acoustic microscopy (SAM) and by the GrindoSonicTM eigenfrequency method. The few conducted and analyzed temperature cycles so far, allow only a conclusion to the circuit carrier reliability but none to the die interconnection reliability. No damage was detected for the dimpled Al2O3-DCB substrates, a special type of AlN-AMB substrate and the Si3N4-AMB substrate.
Lead-free interconnection technologies in power electronics modules - an approach from the EU-funded project 'HOPE'
Bleifreie Verbindungstechnologie bei Leistungselektronikmodulen - ein Vorschlag des EU geförderten Projekts HOPE
2007
7 Seiten, 13 Bilder, 2 Tabellen, 9 Quellen
Conference paper
Storage medium
English
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