Soldering is the major interconnection technology for recent automotive electronic components. Refinement of solder additives has made its fatigue life five times longer than in the past. On the other hand, solder-free interconnection technologies, such as electronic conductive resin and wire bonding, are also applied to designated portions of electronic components. To meet the ban on chlorofluorocarbons, hot water-soluble solder flux and its assembly process are being focused on. In the future, higher density chip assembly technologies will require both suitable fine solder and accurate alignment technology. This trend should accelerate the development of wash-free solder paste. Currently, there are many difficulties in achieving both productivity and long life.


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    Title :

    Recent interconnection technologies of automotive electronics


    Additional title:

    Neue Verbindungstechnologien für die Kraftfahrzeugelektronik


    Contributors:
    Ono, H. (author) / Sawada, Y. (author) / Kawai, K. (author) / Kagosaki, S. (author)


    Publication date :

    1994


    Size :

    9 Seiten, 16 Bilder, 4 Tabellen, 10 Quellen




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Recent interconnection technologies of automotive electronics

    Ono,H. / Sawada,Y. / Kawai,K. et al. | Automotive engineering | 1994


    Recent Interconnection Technologies of Automotive Electronics

    Ono, H. / Sawada, Y. / Kawai, K. et al. | British Library Conference Proceedings | 1994


    Interconnection in Automotive Electronics

    Watts, B. S. | SAE Technical Papers | 1982


    Interconnection in automotive electronics

    Watts,B.S. / AMP Great Britain,Stanmore,GB | Automotive engineering | 1982


    Interconnection and packaging technologies for automotive mechatronics

    Lange, P. / Herrmann, R. / VDI; Gesellschaft Fahrzeug- und Verkehrstechnik | British Library Conference Proceedings | 1996