A manufacturing technology for corona-resistant polyimide film has been developed. The dielectric consists of polyimide film with thin layers deposited on both sides by means of the polymerization of silicone in a DC discharge. The thickness of the silicone layers applied is 0.05 to 0.1 micrometer. The corona-resistant film has been tested on copper-bus mockups in long-term exposure to an electric field. The conductivity of the film is investigated in the range of 20 to 200 deg C. In comparison with other familiar polymer dielectrics, the residual conductivity of the film is very low. Polarization of this dielectric does not lead to the formation of excess positive charge in its volume under the action of high electric fields. Thus, this layer is a barrier to charges injected into the delectric surface from the electrodes and the air gaps.


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    Title :

    Corona-resistant dielectric based on polyimide film


    Additional title:

    Koronabeständiges Dielektrikum auf der Basis von Polyimidfilm


    Contributors:
    Drachev, A.I. (author) / Pak, V.M. (author)

    Published in:

    Publication date :

    2005


    Size :

    3 Seiten, 3 Bilder, 1 Tabelle, 4 Quellen



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English





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