A manufacturing technology for corona-resistant polyimide film has been developed. The dielectric consists of polyimide film with thin layers deposited on both sides by means of the polymerization of silicone in a DC discharge. The thickness of the silicone layers applied is 0.05 to 0.1 micrometer. The corona-resistant film has been tested on copper-bus mockups in long-term exposure to an electric field. The conductivity of the film is investigated in the range of 20 to 200 deg C. In comparison with other familiar polymer dielectrics, the residual conductivity of the film is very low. Polarization of this dielectric does not lead to the formation of excess positive charge in its volume under the action of high electric fields. Thus, this layer is a barrier to charges injected into the delectric surface from the electrodes and the air gaps.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Corona-resistant dielectric based on polyimide film


    Weitere Titelangaben:

    Koronabeständiges Dielektrikum auf der Basis von Polyimidfilm


    Beteiligte:
    Drachev, A.I. (Autor:in) / Pak, V.M. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    2005


    Format / Umfang :

    3 Seiten, 3 Bilder, 1 Tabelle, 4 Quellen



    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




    Low-Dielectric-Constant Polyimide Fibers

    Dorogy, William E., Jr. / Proctor, K. Mason / St. Clair, Anne K. | NTRS | 1994




    Low-Dielectric-Constant Polyimide/Glass Composites

    Stoakley, Diane M. / St. Clair, Anne K. / Baucom, Robert M. et al. | NTRS | 1994