MEMS packaging fulfils a crucial role within the function of the MEMS device. Besides the electrical interconnection, the package provides mechanical protection, media separation or coupling (e.g. pressure), signal conditioning, etc., it must enable the resulting package to be manufactured and assembled at low cost. Also, high reliability requirements even under harsh conditions (e.g. oil sink with extreme temperature differences and aggressive ambient) must be fulfilled in order to be accepted in the automotive market. Today, packaging relies either on using well established package types like TO-headers, butterfly or ceramic packages, or - applicable only for very high volume products - customized package developments. Wafer level packages, as being developed in the microelectronic industry, are currently finding their niche and potential wide spread use also for the packaging of MEMS devices. This can incur substantial cost savings in the future, as seen in the microelectronics industry as well.


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    Title :

    Microsystems packaging for automotive applications


    Additional title:

    Ein Mikrosystem-Paket für fahrzeugspezifische Anwendungen


    Contributors:
    Jung, E. (author) / Wiemer, M. (author) / Grosser, V. (author) / Aschenbrenner, R. (author) / Reichl, H. (author)


    Publication date :

    2002


    Size :

    10 Seiten, 13 Bilder, 1 Tabelle, 9 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Microsystems Packaging for Automotive Applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | British Library Conference Proceedings | 2002





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