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    Title :

    Microsystems Packaging for Automotive Applications


    Contributors:

    Conference:

    Conference; 6th, Advanced microsystems for automotive applications ; 2002



    Publication date :

    2002-01-01


    Size :

    10 pages



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Microsystems packaging for automotive applications

    Jung, E. / Wiemer, M. / Grosser, V. et al. | Tema Archive | 2002



    Safety relevant microsystems for automotive applications

    Seidel, H. / Aikele, M. / Rose, M. et al. | Tema Archive | 2001