Today, packaging relies either on using well established package types like TO, butterfly or ceramic packages, or - applicable only for very high volume products - dedicated package developments. Wafer level packages, as being developed in the microelectronic industry, are currently finding their niche and potential wide spread use also for the packaging of MEMS devices. This can incur substantial cost savings in the future, as seen in the microelectronics industry as well. Conventionally, packaging of the devices is a separate process step that provides a structure which can be handled during the subsequent manufacturing sequence and provides the functionality required. However, for high volume products and for optimised performance, an entire (sub-) system may be designed from the beginning to provide highest cost efficiency, highest function density and optimum performance. Such devices are 'functional packages' which not only encase the device function but add their own functionality to maximize the overall performance. So far, functional packages find their applications in the consumer industry (e.g. ink jet cartridges) and medical industry (blood sensors), e.g. in throw-away products. However, with 'platform concepts' 're-use of technology' over the various automotive models, the automotive industry can take advantage of the concepts developed for these ultra-low cost products.


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    Title :

    Packaging of micro devices for automotive applications - techniques and examples


    Additional title:

    Packungsdichte von fahrzeugspezifischen, mikrotechnischen Sensoren/Aktoren - Technologie und Beispiele


    Contributors:
    Jung, E. (author) / Grosser, V. (author) / Becker, K.F. (author) / Koch, M. (author)


    Publication date :

    2003


    Size :

    9 Seiten, 7 Bilder, 1 Tabelle, 9 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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