Progress on silicon combined with packaging technologies will be leading the innovation on Automotive Electronic Systems. New packages and advanced chip allow the migration from simple system on package or system on chip to Mixed System Integration. MECHATRONIC systems, more and more adopted in automotive technologies, may be implemented without feeling squeezed for cost reductions, performances and design resources. Usage of silicon based drivers for DC motors is imperative for a better management of high current transient across the motor. The tight transients control slashes the unwanted noise energy induced onto signal-carrying conductors; power management of electronic systems populating existing and future cars will benefit as well. This paper shows the performance and benefits of using devices based on mixed system integration. A specific application - Power Window Motor -is discussed providing the potential architecture of a control unit based on a multi-island package and an optimised chip set. The power stage along with signal/data processing and LIN BUS interface will be discussed as well. Functional aspects, troubleshooting problems procedure and thermal management analysis are provided. Advanced DC motor drive trend are partially explored.


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    Title :

    Mechatronic DC motor drive solution for automotive with a new multi power package and an optimised chip set


    Additional title:

    Mechatronische DC-Antriebe für das Kraftfahrzeug mit neuen Power-Chips


    Contributors:
    Caro, G. di (author) / Letor, R. (author) / Liporace, N. (author) / Russo, A. (author)


    Publication date :

    2002


    Size :

    7 Seiten, 17 Bilder


    Type of media :

    Conference paper


    Type of material :

    Storage medium


    Language :

    English




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