A variety of polyimide adhesive formulations has been evaluated for bonding Space Shuttle components of titanium and graphite-polyimide composites. Target requirements for these ahdesives include operational capability at 600 F, lap shear strength in excess of 2000 psi at temperatures to 600 F, and ability to form void-free, large-area bonds. The evaluation indicates that several addition-type polyimide adhesives meet the target requirements. (Wassmann)


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    Title :

    Polyimide adhesives for the space shuttle


    Additional title:

    Polyimide Klebstoffe fuer das Space Shuttle


    Contributors:


    Publication date :

    1979


    Size :

    14 Seiten, 11 Bilder, 11 Tabellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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