Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.


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    Title :

    The development of aerospace polyimide adhesives


    Contributors:

    Conference:

    Tech. Conf. on Polyimides ; 1982 ; Ellenville, NY, United States


    Publication date :

    1983-01-01


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English




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