Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.


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    Titel :

    The development of aerospace polyimide adhesives


    Beteiligte:
    St.clair, A. K. (Autor:in) / St.clair, T. L. (Autor:in)

    Kongress:

    Tech. Conf. on Polyimides ; 1982 ; Ellenville, NY, United States


    Erscheinungsdatum :

    01.01.1983


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Development of Aerospace Polyimide Adhesives

    A. K. St.Clair / T. L. St.Clair | NTIS | 1983


    The development of aerospace polyimide adhesives

    St. Clair, A. K. / St. Clair, T. L. | NTRS | 1984


    Adhesives for Aerospace

    Meade, L. E. | NTRS | 1985


    Elastomer-Toughened Polyimide Adhesives

    St. Clair, A. K. / St. Clair, T. L. | NTRS | 1982


    High-temperature adhesives for polyimide films

    St. Clair, A. K. / St. Clair, T. L. / Slemp, W. S. | NTRS | 1979