Electronic devices for automotive electronic applications have to be operated under extreme environmental conditions and therefore are required to have higher reliability compared with general electronic equipment. Recently automotive voltage regulators, ignition systems, etc. have been changing from mechanical constructions to electronic using thick tilm technology. The authors' present result shows that flip chip IC technology can satisfy the high reliability requirements of automobile electronics.
Reliability considerations of flip chip components for automotive electronic applications
Zuverlaessigkeitsueberlegungen von Flipchipkomponenten fuer Anwendungen in der Automobilelektronik
Electrocomponent Science and Technology ; 9 , 1 ; 87-92
1981
6 Seiten, 3 Quellen
Article (Journal)
English
Soldered flip chip IC's in automotive applications
Tema Archive | 1998
|Alternative solders for flip chip applications in the automotive environment
Tema Archive | 1998
|High temperature potential of flip chip assemblies for automotive applications
Tema Archive | 2005
|Custom I.C.Development And Reliability Considerations For Automotive Applications
Automotive engineering | 1984
|Low-cost solder bumping and flip-chip assembly for automotive microsystem applications
Tema Archive | 2003
|