High Density Standard Modules (HDSMs) were developed several years ago by Texas Instrument to meet the next generation hardware requirements and to reduce the cost and supportability efforts through volume use of proven elements. Standardization has become a key goal of the joint services who will realize a tremendous lift from the reduction of inventoriable items, standardized support equipment and increased competition. A number of standard module configurations have been proposed to meet the next generation system requirements. Even though the various candidates have evolved from different roots they have grown to be more similar than diverse. This is due in part to the evolving limitations of the requirements and to the coordinating efforts of the Air Force, Navy and industry. Further definition and coordination will be required before a true standard module design is levied, but the efforts look hopeful. Significant size, weight, power and reliability improvements can be achieved in next generation avionics by the modular integration of similar functions into a fault tolerant reconfigurable architecture. The Integrated Communication Navigation Identification Avionics program (ICNIA), an ITT/TI Joint Venture, is accomplishing this task with a combination of modular circuit design using VHSIC technology, improved packaging designs incorporating surface mount component technology and a modular two-level maintenance support concept for reduced life cycle cost. This article will concentrate on the modular packaging technology of the digital processor subsystem.


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    Title :

    Modular ICNIA packaging technology


    Additional title:

    Modulares integriertes Avionikprogramm fuer Nachrichtentechnik, Navigation und Identifikation


    Contributors:


    Publication date :

    1986


    Size :

    4 Seiten, 5 Bilder, 3 Tabellen, 2 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English