Widespread implementation and integration of chip carrier packaging into electronic systems and products throughout the industry has been slow due to various technical and manufacturing restraints. Companies electing to use this innovative form of packaging must investigate the areas of thermal expansion mismatch, power cycling, and thermal dissipation. With each individually proposed chip carrier system, the packaging concept must be optimized to meet the particular application needs and operating environments. This paper describes an integrated packaging approach used to adapt leadless chip carrier technology (i.e., surface-mounted technology) into various products. Reliability aspects in the selection of available chip carrier printed wiring board (PWB) substrate materials is addressed. The specific areas of temperature cycling and power cycling associated with chip carrier implementation into product lines are highlighted.


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    Title :

    Integrating chip carrier packaging technology into avionic systems


    Additional title:

    Die Montage von Chiptraegern in der Avionik


    Contributors:
    Banas, E.C (author) / Chappell, C.D. (author)

    Published in:

    Publication date :

    1984


    Size :

    14 Seiten, 8 Bilder, 4 Tabellen, 14 Quellen


    Type of media :

    Report


    Type of material :

    Print


    Language :

    English






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