Interconnect could provide physical and logical connection between two electronic devices with interconnect with affordable quality and reliability, and thus interconnect is critical for the development of Advanced Driver Assistance Systems (ADAS). In this chapter, interconnects and solder joint technology for applications under the hood are reviewed. In addition, the bonding techniques by using Cu-Cu direct bonding and hybrid bonding are presented.


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    Title :

    Interconnect


    Contributors:
    Li, Yan (editor) / Shi, Hualiang (editor) / Huo, Yongjun (author) / Liu, Yingxia (author) / Ouyang, Fan-Yi (author)


    Publication date :

    2022-10-28


    Size :

    32 pages




    Type of media :

    Article/Chapter (Book)


    Type of material :

    Electronic Resource


    Language :

    English




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