This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system. This document has been determined to contain basic and stable technology which is not dynamic in nature.
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
2017-11-29
Conference paper
English
Insulation , Test procedures , Drag , Thermoplastics , Drying , Resins , Suppliers , Documentation , Polymers
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