This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
1987-10-01
Conference paper
English
Insulation , Test procedures , Drag , Thermoplastics , Molding , Drying , Casting , Resins , Suppliers , Polymers
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