This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.Cancel due to inaccurate technical requirements.
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
2016-09-22
Conference paper
English
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
SAE Technical Papers | 1981
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SAE Technical Papers | 1993
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POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE Technical Papers | 1981