This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.Cancel due to inaccurate technical requirements.
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
22.09.2016
Aufsatz (Konferenz)
Englisch
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
SAE Technical Papers | 1981
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
SAE Technical Papers | 1993
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
SAE Technical Papers | 2011
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE Technical Papers | 2016
POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE Technical Papers | 1981