This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.


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    Title :

    POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm


    Publication date :

    2011-08-09



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English